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plasma planarization

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  • Semiconductor device fabrication — Semiconductor manufacturing processes 10 µm 1971 3 µm 1975 1.5 µm 1982 …   Wikipedia

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  • Nano-RAM — Computer memory types Volatile RAM DRAM (e.g., DDR SDRAM) SRAM In development T RAM Z RAM TTRAM Historical Delay line memory Selectron tube Williams tube Non volatile …   Wikipedia

  • Surface finishing — is a broad range of industrial processes that alter the surface of a manufactured item to achieve a certain property.[1] Finishing processes may be employed to: improve appearance, adhesion or wettability, solderability, corrosion resistance,… …   Wikipedia

  • Lam Research — Infobox Company company name = Lam Research Corporation company company type = Public (NASDAQ|LRCX) foundation = 1980 location = key people = David K. Lam, Founder James W. Bagley, Chairman of the Board Stephen G. Newberry, Chief Executive… …   Wikipedia

  • Copper interconnect — Copper based chips are semiconductor integrated circuits, usually microprocessors, which use copper for interconnections. Since copper is a better conductor than aluminium, chips using this technology can have smaller metal components, and use… …   Wikipedia

  • Grabenisolation — Die Grabenisolation (englisch shallow trench isolation, STI, auch box isolation technique) ist ein Verfahren der Halbleitertechnik zur elektrischen Isolation einzelner Bauelemente (hauptsächlich MIS Feldeffekttransistoren) auf integrierten… …   Deutsch Wikipedia

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